Testing can support a new prototype, a design revision, an existing production issue, or a specific hardware-firmware integration problem.
Design and Test Readiness Review
Before lab work begins, we review requirements, architecture, schematics, PCB files, BOM, datasheets, interface definitions, firmware version, known issues, electrical limits, test procedures, fixtures, and instruments. Missing information and test limitations are recorded before conclusions are made.
Visual and Assembly Inspection
Initial checks can cover PCB and assembly condition, component orientation, missing or incorrect components, visible soldering defects, connector and cable condition, mechanical interference, assembly variation, damage, and contamination.
Power-System Verification
Power testing can cover input current, rail voltages, rail sequencing, reset behaviour, inrush observations, regulator output, load response, power consumption, brownout and restart behaviour, and protection behaviour within an agreed safe test range.
Digital Interface Verification
We verify supported digital interfaces with appropriate instruments and test firmware, including GPIO, UART, SPI, I2C, CAN, Ethernet, USB, PWM, timers, counters, interrupts, external memory, and programming or debug interfaces.
Analogue and Sensor Interface Testing
Tests can include input range, offset and gain observations, ADC readings, DAC or analogue-output checks, sensor excitation, signal conditioning, noise observations, channel consistency, calibration-data handling, and boundary-input cases.
Communication Testing
Communication verification can include physical-layer observation, baud rate or clock checks, frame and packet inspection, addressing, configuration, error and timeout behaviour, reconnection, data integrity, interoperability, and extended-run tests.
Hardware-Firmware Integration Testing
Integration testing verifies pin configuration, peripheral selection, clocks, interrupts, buffers, memory, DMA, timing, reset, startup, power states, driver errors, watchdog recovery, and bootloader/application interaction.
Thermal and Extended-Operation Observation
Where equipment and scope permit, we monitor component temperature, board temperature, power consumption, communication stability, memory or resource behaviour, restart events, output consistency, and long-duration operation under representative load.